What's New at IEEE
What's New @ IEEE in Circuits May 30, 2007
INSIDE THIS ISSUE
Welcome to the New 'What's New @ IEEE'
SUSHI Statistics Available to IEEE Customers
Mass Production of High-Capacity Chip Geared for Digital Devices
Nanoelectronics Standards Roadmap Completed
Researchers Develop Nanocomposite Processing Techinique to Produce Stronger Capacitors
Buy Now and Save: 20% off Wiley-IEEE Books
Silicon-Stacking Technology May Increase Chip Performance
Cornell Researchers Develop Tiniest Organic Light ‘Bulbs’

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Welcome to the New 'What's New @ IEEE'

IEEE is proud to introduce a new format for all eight of its 'What's New @ IEEE' newsletters. The updated format uses an html-based platform to provide a more polished, easier-to-navigate newsletter with embedded hyperlinks. Please take this opportunity to update your current information by following the link on the bottom left-hand column.

 

 

SUSHI Statistics Available to IEEE Customers

MPS, the vendor IEEE uses for counter compliant statistics, has adopted the SUSHI data transfer protocol and is now available to IEEE customers who also subscribe to Scholarly Stats products from MPS. SUSHI (Standardized Usage Statistics Harvesting Initiative) allows users to view usage statistics across multiple platforms, saving time and resources for the library. Read more

 
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Mass Production of High-Capacity Chip Geared for Digital Devices

The development of a 16 GB NAND flash memory chip geared for use in digital music players, music phones, and digital cameras was recently announced by Samsung Electronics. The mass-produced chip is expected to be the highest capacity memory chip available, according to the South Korean company. To create the chips, Samsung used a 51-nanometer manufacturing process that allows for NAND flash chips to operate 60 percent more efficiently than the traditional 60-nanometer process commonly used in the industry and increases the read-write speeds by about 80 percent over current data processing speeds. Read more

 
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Nanoelectronics Standards Roadmap Completed

The IEEE has completed its Nanoelectronics Standards Roadmap(NESR), which establishes a framework for creating standards to help industry transition electronic applications based on nanotechnology from the laboratory to commercial use. The roadmap recommends the initiation of five nanoelectronic standards:  three for nanomaterials involving conductive interconnects, organic sensor structures and nano-dispersions and two for nano-devices involving nanoscale sensors and nanoscale emitting devices.  It also targets the start of seven nanomaterial standards and five nano-device standards in 2008. To access the document, visit

 
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Researchers Develop Nanocomposite Processing Techinique to Produce Stronger Capacitors

A fresh technique for producing films of barium titanate nanoparticles in a polymer matrix was recently developed by a team of researchers at the Georgia Institute of Technology. The end result may allow for the development of improved capacitors that have the ability to store twice as much energy as existing devices. These enhanced capacitors may be used in a wide variety of devices – from cellular telephones to defense applications. The researchers surpassed previous difficulties other scientists encountered in dispersing the substance within a polymer matrix by using tailored organic phosphonic acids to contain and change the surface of the nanoparticles and produce uniform nanocomposites. Read more

 
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Buy Now and Save: 20% off Wiley-IEEE Books

Wiley-IEEE Press books are available at a 20% discount for a limited time. Choose from a variety of titles through the online catalog. Topics include circuits and systems, power engineering, signal processing, microwave technology and more. Learn more

 
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Silicon-Stacking Technology May Increase Chip Performance

Next year, IBM aims to begin commercial production of microprocessors that make use of a chip-stacking technology that will enhance the performance of the chips. The technology, “through-silicon vias”, will be used to build memory components on top of processors for quicker access to information and instructions as compared to common configurations, which place memory parts next to a processor. According to IBM officials, placing these parts on top of the CPU allows the processor to acquire the data faster, increasing its calculation and operating speed. By stringing a wire through the layers of the device, data can flow through the stack to the processor, allowing the components to be manufactured as a vertical package. Read more

 
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Cornell Researchers Develop Tiniest Organic Light ‘Bulbs’

Researchers at Cornell University (USA) have created microscopic “nanolamps” – the tiniest organic light-emitting nanofibers. The fibers are just 200 nanometers wide and are composed of a compound based on the metallic element ruthenium. The development may provide benefits in applications ranging from sensing to microscopy. Through a technique called electrospinning, the researchers swirled the fibers from a mixture of the metal complex ruthenium tris-bipyridine and the polymer polyethylene oxide. They discovered that the fibers transmit an orange light when stimulated by low voltage through micro-patterned electrodes, similar to the way a tiny light bulb emits light. Read more

 
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