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Special Issue: What’s New @ IEEE Year-in-Review
This month’s issue of What’s New @ IEEE in Circuits will take a look back at the most popular news stories for the past year. Ranked in order of popularity based on the number of clicks received, each story will give a brief synopsis of the initial article, provide links to the original What’s New story and full article, and include recent updates on the featured technology, where applicable.

Notre Dame Professor Receives IEEE Award
Dr. Rueywen Liu, a leader in the electrical engineering field, was named the 2007 recipient of the IEEE Circuits and Systems Society’s Mac Van Valkenburg Award. The medal honors Liu for his role in the development of a new multiple access system for wireless communication, in addition to his research in circuits and systems, signal processing, and communication.
See initial What’s New @ IEEE article (August 2007)
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New Technique Signals End of Semiconductors
A University of Houston (USA) professor, Dr. Dmitri Litvinov, has developed a technique that uses magnetic cellular networks to take the place of traditional circuitry, greatly enhancing computing operations. The new method could yield greater computing power and possible integration with magnetic random access memory. According to an interview with Litvinov in the Houston Business Journal, the electrical and computer engineering professor believes the new technology “could replace microchip technology in everything from cell phones to supercomputers.”
See initial What’s New @ IEEE article (September 2007)
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Intel CTO: Future of Transistors Different, But Hard to Predict
In 10 years, transistors may not look anything like those currently available in today’s market, according to Justin Rattner, Intel’s Chief Technology Officer, who answers questions about the future of the transistor industry in an interview published on Computing SA Online.
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Generating Power from Body Heat
Electronic devices powered by human body heat have been made possible by combining components in a new way, according to scientists at the Fraunhofer Institute in Germany, who say they have created circuits that can operate on 200 millivolts. The technology uses thermoelectric generators (TEGs) made from semiconductor elements that extract electrical energy from the several-degree difference in temperature between the human body and its surrounding environment.
See initial What’s New @ IEEE article (August 2007)
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Battery-Free, Wireless Sensor Integrates All Functions in a Single Module
EnOcean, a technology manufacturer based out of Boston, Massachusetts, USA, has introduced the world’s first wireless and battery-free sensor transmitter. The affordable technology combines all sensor functions – storing solar energy, converting DC to DC efficiently, measuring incoming data with ultra low power electronics and transmitting via radio signals – into a single device. EnOcean’s most recent venture has been in energy harvesting, with wireless buttons that use RF signals to control lights, temperatures, and other energy sources.
See initial What’s New @ IEEE article (September 2007)
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Micro-Generator Powered by Vibration
An electric generator the size of a sugar-cube and powered by environmental vibrations has been developed by engineers at the University of Southampton in the United Kingdom. The researchers say their generator, which produces up to 46 microwatts of electrical power, could run all sorts of wireless sensors or medical implants. The new micro-generator, called Mk2, was developed as part of a wider European program called Vibration Energy Scavenging. The program is dedicated to the development of microsystems that can create electrical energy from environmental vibrations and movements.
See initial What’s New @ IEEE article (July 2007)
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Visit Vibration Energy Scavenging (VIBES) website
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New IEEE Xplore® Toolbar Introduced
Earlier this year, IEEE released the IEEE Xplore Toolbar. The new toolbar, easily downloaded, provides users with instant access to the IEEE Xplore digital library of premier technical literature in electrical engineering, computer science, and electronics.
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See-Through Electronics Visible on the Horizon
Transparent electronics – electrodes, semiconductors, transistors, circuits, and other elements – may be commercially possible in a year or two, according to researchers, who say the technology will enable the embedding of transparent electronic circuits into large areas, like windows, for the display of video imagery. New research has shown that nanotubes can offer a practical choice for fabricating transparent, thin film electronics such as flat-panel displays and future opto-electronics devices.
See initial What’s New @ IEEE article (November 2007)
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Silicon-Stacking Technology May Increase Chip Performance
Next year, IBM aims to begin commercial production of microprocessors that make use of a chip-stacking technology that will enhance the performance of the chips. The technology, “through-silicon vias”, will be used to build memory components on top of processors for quicker access to information and instructions as compared to common configurations, which place memory parts next to a processor.
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Evolutionary Algorithms Challenge Intelligent Designers
Computer scientists and designers are squaring off over evolution versus intelligent design – this time in engineering. The debate centers on the use of evolutionary algorithms (EAs), which mimic the process of natural selection by “breeding”.
See initial What’s New @ IEEE article (August 2007)
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Search research on evolutionary algorithms in IEEE Xplore
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Mass Production of High-Capacity Chip Geared for Digital Devices
The development of a 16 GB NAND flash memory chip geared for use in digital music players, music phones, and digital cameras was announced by Samsung Electronics. The mass-produced chip is expected to be the highest capacity memory chip available, according to the South Korean company. Developing NAND Flash memory has become extremely popular with electronics manufacturers in recent months. The technology, which may prove a viable substitute for hard disks in power-critical applications, is expected to lead the next-generation memory chip market.
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