Brion Technologies, a company that provides optical proximity correction tools for manufacturing groups, plans to introduce its first product geared towards IC design teams at the June Design Automation Conference. Named Tachyon Lithography Aware Design (LAD), the product strives to aid designers in the discovery and remediation of lithography-generated hot spots before the tapeout stage. The technology, by analyzing GDSII information, replicates how the lithography procedure will reproduce a design on silicon. LAD also reveals silicon textures and lithography hot spots, which can show designers or EDA tools how to correct layouts and rectify problems. Read more

Intel recently launched a series of engineering presentations in Second Life, the 3-D virtual world entirely built and owned by its residents, as an extension of Intel’s Web presence. The program allows developers of multicore, manageability, and mobility technologies to communicate with Intel engineers and experts. Highlights include the Intel Software Network Area, which will feature online training, Webcasts, and meet-the-experts events, as well as the “Braniac Warbots” contest, where participants create competing robots through the use of Second Life standard Linden Scripting Language (LSL). Intel plans to determine its return on the investment by listening to feedback from developers, analyzing repeat visits, and seeing how many developers interact with the community. Read more

 
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The concept of cyberinsurance is fairly new, but of growing importance to the needs of information technology security at every level, according to an article in the May/June 2007 IEEE Security and Privacy newsletter. Many benefits can be found in obtaining cyberinsurance, according to the article, and it can be a crucial risk-management tool for increasing the strength of IT security and reliability for both individuals and the public as a whole. The quick growth of e-commerce and the Y2K computer dilemma are just two issues that have signaled increased interest in making cyberinsurance a reality for network computer users. Read more

 
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The IEEE and the Association for Electrical, Electronic & Information Technologies (VDE) are sponsoring the “Meeting the Growing Demand for Engineers and their Educators 2010-2020” International Conference to be held in Munich, Germany on 9-11 November 2007. The conference will bring together decision makers from industry, government and education to discuss and plan the preparation of future engineers and the people who educate them. The specific focus for the conference will be to analyze and address the lack of engineers and technical educators worldwide. Main objectives for the summit include establishing and expanding partnerships between the attendees, opening channels of communication, and developing action plans to ensure the proper recruitment and training of future engineers and engineering educators. Attendance of the conference will be limited to ensure quality interaction between participants. Deadline for early registration is 15 August 2007; late registration ends 17 October 2007. For more information about registration or the conference in general, please visit

 
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The distance learning experience has been greatly improved through the growth in available broadband network services and mobile access, according to the May/June 2007 issue of IEEE Internet Computing. While adaptive multimedia technology and emergent learning environments provide positive improvements to distance learning, challenges include creating a more learner-centered approach to ensure learner collaboration, construction, and reflection. Several trends in technology-enhanced learning are geared towards achieving this objective, including the rise of interactive games, the embedding of collaboration within learning opportunities, and a move toward constructivist approaches to learning communities. Read more

 
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As researchers strive to put more computational power into tinier devices, a need has risen for faster and more flexible computers. A research group at the University of California, San Diego, California, USA, is working on this dilemma by employing electron spin and charge. The group has devised plans for a semiconductor-based spintronic device that does the same logical operations as normal chip transistors. According to the researchers, their proposal is a first glimpse at how to produce a real machine out of spin-based devices. Read more

 
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Highlighted in the guest editor’s introduction, the special topic for the May issue of Computing in Science & Engineering (CiSE) is the computing programming language Python and its increasing role in recent scientific projects. Python, which is free and universally available, has an extensive set of third-party tools and comes with a vast standard library containing support for nearly every area of computer science. The introduction outlines the range of articles available in the May issue of Computing, which includes a basic overview of Python as well as the more advanced functions of the programming language. The issue also includes more in-depth articles featuring specific projects utilizing Python in a wide variety of scientific, engineering, and educational applications. To read the guest editor’s article or other articles in the May issue of Computing, visit

 
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A call for papers has been sent out for the “Meeting the Growing Demand for Engineers and their Educators 2010-2020” International Conference to be held in Munich, Germany on 9 - 11 November 2007, sponsored by the IEEE and the Association for Electrical, Electronic & Information Technologies (VDE). The conference will bring together decision makers from industry, government and education to discuss and plan the preparation of future engineers and the people who educate them. The specific focus for the conference will be to analyze and address the lack of engineers and technical educators worldwide. Attendance of the conference will be limited to ensure quality interaction between participants. Deadline for proposed paper synopsis is 30 June 2007; the deadline for final paper submissions is 1 October 2007. For more information about submitting a paper or the conference in general, please visit

 
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