Conference Brief
 
 
 
 
Thank you for reading the IEEE Electron Devices Society (EDS), Conference Brief. If you have EDS-specific conference news to share with your EDS colleagues, please send an email for possible publication in an upcoming Conference Brief.
 
 
FEATURED CONFERENCES
 
 
 
 
2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)

It is with great pleasure that we welcome you to be a part of the 2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS). BCICTS brings together distinguished experts to present their latest results in bipolar, SiGe BiCMOS, and compound semiconductor circuits, devices, and technology. There are no other events in the world where you can see leading edge bipolar/BiCMOS devices and technology, 5G ICs, GaN HPAs, InP THz PAs, optical CMOS/SiGe transceivers, GaN HEMT power devices, and advances in compact modeling all presented together. BCICTS includes presentations from submissions contributed worldwide on all aspects of these technologies.

 
 
Monterey, CA, USA
5-8 December 2021
 


 
 
 
 
 
 
2021 IEEE International Flexible Electronics Conference (IFETC)

8-11 August 2021
Virtual Event

It is our great pleasure to invite you to attend the 2021 IEEE International Flexible Electronics Conference (IFETC)! The IFETC-3 will be held 8-11 August 2021 online as a virtual conference. With the safety of our participants in mind, IFETC 2021 will be a live virtual conference.

IFETC-3’s Technical Program covers a wide range of cutting-edge developments in printed and flexible electronics. IFETC, started in Ottawa, Canada (2018) is a new EDS-lead international conference, focusing upon printed and flexible hybrid and non-hybrid materials, devices and systems. It will rotate between the Americas, Asia and Europe, heading to Shanghai PRC in 2022. IFETC aims to bring together a wide variety of stakeholders, from chemists, materials scientists, physicists, to mechanical and electrical engineers, the fabrication and manufacturing communities, as well as end-users, e.g. packaging and medical communities.

 
 
 
 
 
 
 
 
CALL FOR PAPERS
 
 
2021 IEEE International Electron Devices Meeting (IEDM)

11-15 December 2021 | Hybrid Event

Submission Deadline:
23 July 2021

Conference Website

 
 
2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)

5-8 December 2021 | Monterey, CA, USA

Submission Deadline:
6 August 2021

Conference Website

 
 
2022 34th IEEE International Conference on Microelectronic Test Structures

21-24 March 2022 | Cleveland, OH

Submission Deadline:
29 October 2021


Conference Website

 
 
UPCOMING CONFERENCES
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
CONFERENCE UPDATES
 
 
Below are the IEEE requirements for all IEEE financially sponsored conferences. All IEEE EDS conferences must abide by these guidelines in order to have compliant contracts.

If you have any questions or need assistance, please contact Jessica Lotito, CMP at the IEEE EDS office at j.lotito@ieee.org.

Contract review
All conference-related purchase transactions valuing US$1,000 or greater must be reviewed by the IEEE Conference Contracts Department before execution.

You may refer to the following chart for guidance on the appropriate review process for your transaction.
 
 
 
 
 
 
CONFERENCE TOOLS
 
 
 
 
 
 
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