Conference Brief
 
 
 
 
Thank you for reading the IEEE Electron Devices Society (EDS), Conference Brief. If you have EDS-specific conference news to share with your EDS colleagues, please send an email for possible publication in an upcoming Conference Brief.
 
 
FEATURED CONFERENCES
 
 
 
 
2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)

It is with great pleasure that we welcome you to be a part of the 2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS). BCICTS brings together distinguished experts to present their latest results in bipolar, SiGe BiCMOS, and compound semiconductor circuits, devices, and technology. There are no other events in the world where you can see leading edge bipolar/BiCMOS devices and technology, 5G ICs, GaN HPAs, InP THz PAs, optical CMOS/SiGe transceivers, GaN HEMT power devices, and advances in compact modeling all presented together. BCICTS includes presentations from submissions contributed worldwide on all aspects of these technologies.

 
 
Virtual Event
6-9 December 2021
 


 
 
 
 
 
 
2021 IEEE International Electron Devices Meeting (IEDM)

IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

 
 
San Francisco, CA, USA
Hybrid Event
11-15 December 2021
 


 
 
 
 
 
 
CALL FOR PAPERS
 
 
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2022 6th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 

6-9 March 2022 | Oita, Japan

Submission Deadline:
18 October 2021

Conference Website

 
 
2022 34th IEEE International Conference on Microelectronic Test Structures

21-24 March 2022 | Cleveland, OH

Submission Deadline:
29 October 2021


Conference Website

 
 
UPCOMING CONFERENCES
 
 
 
 
Tucson AZ / Hybrid Event | 26 September - 1 October 2021
 
 
Virtual Event | 6-8 October 2021
 
 
 
 
 
 
 
 
 
 
 
 
 
 
CONFERENCE UPDATES
 
 
New TCS Fee Structure
IEEE introduced Technical Co-Sponsor Fees (TCS Fees) in 2018 for all technically co-sponsored conferences in which there is no IEEE financial interest (0%). Please note that there will be a new TCS Fee structure in effect for any conferences occurring after 31 December 2020.

You may refer to the following bullets for guidance on the appropriate review process for your transaction.
  • US $1,450 per event
  • US $22 for each paper submitted to IEEE Xplore®
Technical Co-Sponsors have the option to pass this fee on to their conferences. If this occurs, the conference is responsible for paying a portion of the fee. Conferences should be mindful of this cost when budgeting for their event.

Below are the IEEE requirements for all IEEE financially sponsored conferences. All IEEE EDS conferences must abide by these guidelines in order to have compliant contracts.

If you have any questions or need assistance, please contact Jessica Lotito, CMP at the IEEE EDS office at j.lotito@ieee.org.


Contract review
All conference-related purchase transactions valuing US$1,000 or greater must be reviewed by the IEEE Conference Contracts Department before execution.

You may refer to the following chart for guidance on the appropriate review process for your transaction.
 
 
 
 
 
 
CONFERENCE TOOLS
 
 
 
 
 
 
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