Conference Brief
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2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)

It is with great pleasure that we welcome you to be a part of the 2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS). BCICTS brings together distinguished experts to present their latest results in bipolar, SiGe BiCMOS, and compound semiconductor circuits, devices, and technology. There are no other events in the world where you can see leading edge bipolar/BiCMOS devices and technology, 5G ICs, GaN HPAs, InP THz PAs, optical CMOS/SiGe transceivers, GaN HEMT power devices, and advances in compact modeling all presented together. BCICTS includes presentations from submissions contributed worldwide on all aspects of these technologies.

Virtual Event
6-9 December 2021

2021 IEEE International Electron Devices Meeting (IEDM)

IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

San Francisco, CA
Hybrid Event
11-15 December 2021

IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD) 

22-26 May 2022 | Vancouver, BC Canada

Submission Deadline:
10 December 2021

Conference Website

IEEE 23rd International Vacuum Electronics Conference (IVEC)  

25-29 April 2022 | Monterey, CA

Submission Deadline:
20 December 2021

Conference Website

2022 IEEE Latin American Electron Devices Conference (LAEDC)

27-30 April 2022 | Cancun, Mexico

Submission Deadline:
21 January 2021

Conference Website

IEEE Radio Frequency Integrated Circuits Symposium (RFIC) 

19-21 June 2022 | Denver, CO

Submission Deadline:
16 January 2022

Conference Website

San Francisco, CA USA | 11-16 December 2021
New TCS Fee Structure
IEEE introduced Technical Co-Sponsor Fees (TCS Fees) in 2018 for all technically co-sponsored conferences in which there is no IEEE financial interest (0%). Please note that there will be a new TCS Fee structure in effect for any conferences occurring after 31 December 2020.

You may refer to the following bullets for guidance on the appropriate review process for your transaction.
  • US $1,450 per event
  • US $22 for each paper submitted to IEEE Xplore®
Technical Co-Sponsors have the option to pass this fee on to their conferences. If this occurs, the conference is responsible for paying a portion of the fee. Conferences should be mindful of this cost when budgeting for their event.

Below are the IEEE requirements for all IEEE financially sponsored conferences. All IEEE EDS conferences must abide by these guidelines in order to have compliant contracts.

If you have any questions or need assistance, please contact Jessica Lotito, CMP at the IEEE EDS office at

Contract review
All conference-related purchase transactions valuing US$1,000 or greater must be reviewed by the IEEE Conference Contracts Department before execution.

You may refer to the following chart for guidance on the appropriate review process for your transaction.
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