Conference Brief
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6th Electron Devices Technology and Manufacturing Conference (EDTM 2022)

6-9 March 2022
Oita, Japan

The 6th Electron Devices Technology and Manufacturing Conference (EDTM 2022) will be held in Oita, Japan, located in Kyushu Island where many semiconductor companies have facilities, and called as silicon island in Japan. EDTM 2022 is a full four-day conference to be held during 6-9 March 2022. EDTM 2022 aims to be a premier global forum for researchers and engineers from around the world coming to share new discoveries and discuss about any device/manufacturing-related topics, including but not limited to, materials, processes, devices, packaging, modeling, reliability, manufacturing and yield, tools, testing, and any emerging device technologies, as well as workforce training.

The Theme for EDTM 2022 is: Semiconductor Devices and Manufacturing Innovations for a More Sustainable World.

49th IEEE Photovoltaic Specialists Conference (PVSC)

For 60 years, PVSC has been the premier scientific and technical conference focused on all areas of photovoltaics from fundamental science to commercial applications and, increasingly, to deployment, policy, and resources. We continue that tradition by offering a diverse technical program divided into eleven areas and featuring several special and joint technical sessions highlighting our cross cutting synergies.

Philadelphia, PA
5-10 June 2022

We will have a slate of exciting keynote, plenary and invited speakers giving up-to-date research summaries and breakthroughs. A day dedicated to tutorials from leading experts in seminal areas will enable students and scientists joining the field or any participants to expand their knowledge to new areas. Importantly, the conference’s Exhibits area will provide a chance to learn about some of the latest developments in characterization, materials and manufacturing. All of these events will be enhanced by ample opportunities for networking to form new collaborations and friendships as well as renew old acquaintances.
IEEE 23rd International Vacuum Electronics Conference (IVEC)  

25-29 April 2022 | Monterey, CA

Submission Deadline:
20 December 2021

Conference Website

2022 IEEE Latin American Electron Devices Conference (LAEDC)

27-30 April 2022 | Cancun, Mexico

Submission Deadline:
21 January 2022

Conference Website

IEEE Radio Frequency Integrated Circuits Symposium (RFIC) 

19-21 June 2022 | Denver, CO

Submission Deadline:
16 January 2022

Conference Website

2022 80th Device Research Conference

26-29 June 2022 | Columbus, OH

Submission Deadline:
28 February 2022

Conference Website

Dresden, Germany | 15-18 May 2022
New TCS Fee Structure
IEEE introduced Technical Co-Sponsor Fees (TCS Fees) in 2018 for all technically co-sponsored conferences in which there is no IEEE financial interest (0%). Please note that there will be a new TCS Fee structure in effect for any conferences occurring after 31 December 2020.

You may refer to the following bullets for guidance on the appropriate review process for your transaction.
  • US$1,450 per event
  • US$22 for each paper submitted to IEEE Xplore®
Technical Co-Sponsors have the option to pass this fee on to their conferences. If this occurs, the conference is responsible for paying a portion of the fee. Conferences should be mindful of this cost when budgeting for their event.

Below are the IEEE requirements for all IEEE financially sponsored conferences. All IEEE EDS conferences must abide by these guidelines in order to have compliant contracts.

If you have any questions or need assistance, please contact Jessica Lotito, CMP at the IEEE EDS office at

Contract review
All conference-related purchase transactions valuing US$1,000 or greater must be reviewed by the IEEE Conference Contracts Department before execution.

You may refer to the following chart for guidance on the appropriate review process for your transaction.
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